lead rf packaging development engineer at wolfspeed a cree company@ Wolfspeed
Durham, North Carolina, United States
Erwin Cohen
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Purdue University
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FlashIntel GPT
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FlashIntel GPTErwin Cohen is a highly experienced technical lead and program manager in electronic packaging with 15 years of experience. He has a strong background in advanced packaging technology development and has managed package development for high volume consumer gaming processors, MCM, 3D, and SCM processors. Erwin has 8 years of experience as a lead designer in high performance microprocessor packaging, leading teams in signal integrity, power integrity, and thermal management. He has extensive experience co-developing solutions with customers and partners, both for specific products and advanced package technology. Erwin has worked at reputable companies such as Wolfspeed, GlobalFoundries, and IBM.
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About
I have 15 years of experience in electronic packaging. I am technical lead and program manager for advanced packaging technology development, managing package development for high volume consumer gaming processors, MCM, 3D, and SCM processors. I have 8 years experience as a lead designer in high performance microprocessor packaging, leading teams in signal integrity, power integrity and thermal management. I have extensive experience co-developing solutions with customers and partners, both for specific products and for advanced package technology.
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Lead Rf Packaging Development Engineer
lead rf packaging development engineer at wolfspeed a cree company
Semiconductor Manufacturing
Erwin Cohen's Professional Milestones
- Production Supervisor (1988-01-01~1989-08-01): Streamlined production processes, resulting in increased efficiency and reduced costs.
- Process Engineer (1984-07-01~1987-07-01): Optimized production efficiency through enhanced efficiency and quality control measures.
Education
Doctorates,
Masters,
Doctor Of Philosophy,
Master Of Science In Electrical Engineering,
Engineering,
Solid State Electrical Eng
1990-1998Skill
Asic
Processors
Testing
Semiconductors
Microprocessors
Management
Cross Functional Team Leadership
Integration
Product Development
Team Leadership
Debugging
Signal Integrity
Unix
Software Development
Training
Enterprise Software
Simulations
Embedded Systems
Program Management
Ic
Leadership Development
Sdlc
Lean Manufacturing
Scrum
Leadership
System Architecture
Eda
Product Management
Perl
Cmos
Engineering Management
High Performance Computing
Software Engineering
Requirements Analysis
Certification
Colleagues
Michael Pollard
Vice President Legal Chief Compliance Officer
James Norman
IT Portfolio Owner
Theresa R.
Executive Assistant | Chief Information Officer | Global Leader In Production Of Silicon Carbide Materials And Devices
John Perry
General Manager
Chris Morgan
Equipment Owner | Install Engineer
Other Named Erwin Cohen
Frequently asked questions
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Erwin Cohen works for Wolfspeed
Erwin Cohen's role in Wolfspeed is lead rf packaging development engineer at wolfspeed a cree company
Erwin Cohen works in the industry of Semiconductor Manufacturing
Erwin Cohen's colleagues are Michael Pollard,James Norman,Theresa R.
Erwin Cohen's latest job experience is lead rf packaging development engineer at wolfspeed a cree company at Wolfspeed
Erwin Cohen's latest education in Purdue University
