Eyüp Can BALOĞLU

I have M.Sc degree from Middle East Technical University, Mechanical Engineering Department in 2016 with the thesis title “An Experimental and Numerical Investigation of Warpage Behavior of Silicon Substrates at Cryogenic Temperatures”. I have been performing Ph.D studies on the subject of “Failure Analysis of Infrared Sensing Devices due to Cryogenic Cooling” which basically covers defining thermo-elastic material properties of a variety of single crystal semiconductors by Ab-Initio simulations and numerical investigation of crack initiation/propagation of anisotropic single crystal layers with Phase Field Fracture model. I have 9-years of industry experience in electronic device packaging mainly covers thermal and thermo-mechanical management of IR sensors, mechanical design, conventional and non-conventional manufacturing processes, lifetime assesment of electronic packages.