Hehuan Liu
Senior Engineer@ Qualcomm
Shanghai, Shanghai, China
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Hehuan Liu is a highly skilled professional with 12.5 years of experience in digital verification on wireless communication chips. He is proficient in various technologies such as Ban Dao Ti, Asic, and C. He is based in Shanghai, China and has expertise in SDIO 2.0/3, DMA verification, and 802.11 MAC layer. Hehuan Liu has worked at Qualcomm in San Diego, California as a Senior Engineer in the Engineering & Technical department since April 2011. Qualcomm is a telecommunications company with a wide range of products and services, targeting customers in the industry.
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Emails and Phone Numbers

@qualcomm.com
+1 858651****
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About

digital verification on wireless communication chip, mainly on WIFI chip including 802.11 a/b/g/n/ac. familiar with SDIO 2.0/3.0 interface and DMA verification. familiar with 802.11 MAC layer. familiar with LTE/BT coexsitence with 802.11.

Work Experience

Qualcomm, San Diego, CA, 92121, US

Telecommunications

42661
Phone
+1 8586516732

Hehuan Liu's Professional Milestones

  • Senior Engineer (2011-04-01~): Developing cutting-edge technology solutions to revolutionize business operations.

Education

Xidian University
Xidian University

Electronics,

Engineering,

Communications,

Masters,

Bachelors

2004-2008