Hong Fei
Microwave Photonics Research Engineer@ Huawei
Nuremberg, Bayern, Germany
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Hong Fei is a highly skilled professional with 11 years of experience in RF hardware concept/schematic/layout development in the mobile and automotive industry. He has expertise in 3GPP RF related Transceiver KPI Specification and RF Lab experience. Hong Fei has worked at Intel Corporation in California as an Rf Development Engineer and an Antenna Engineer. He also has experience as a Student Worker and a Master Thesis at TU Muenchen. Hong Fei is based in Germany.
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Emails and Phone Numbers

@hays.com
@intel.com
@huawei.com
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About

- First-Hand Experience in RF Hardware Concept/Schematic/Layout Development in Mobile and Automotive area - 3GPP RF related Transceiver KPI Specification - RF Lab Experience - Key Customer On-site Support

Work Experience

Huawei Technologies Co., Ltd., Shenzhen, Guangdong, 518129, CN

Telecommunications

175700
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Hong Fei's Professional Milestones

  • RF Antenna Engineer: Transforming the RFA antenna infrastructure through innovative technologies and streamlined technology development.
  • Student Worker (2013-11-01~2014-03-01): Conducting research and contribute to the development of innovative research solutions.
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