huong do

Huong is currently a substrate design engineer working on delivering package technology solutions for leading edge Intel products ranging from high performance server systems to wireless hand-held products. Her background entails a BS degree in Mechanical Engineering and a MS in Electrical Engineering. In the current position, she has exploited knowledges in both areas to solve complex substrate fabrication problems that address both thermal and mechanical limitations while ensuring the process is low cost and robust. Delivering highly competitive Si products also required knowledge in electrical modelings and simulations that allow I/O interfaces to meet high frequency demands and support power delivery system that required over 200W of power. Everyday brings new challenges and knowledge that Huong passionately embraced and solved with enthusiasm. Her work ethic is a simple line learned from a long-time mentor: “Carpe Diem” … Seize the Day….