Michelle Scheff

Extensive experience as P.C.B. Designer of complex multi-layer high density design including THD, SMT, analog, digital, EMI, cross talk, high speed signal integrity, via-in-pad and back-drill design using Allegro, Daltool and Valor. Also used skills and scripts to help do the job faster. Also used Pads, Cadnetix and Redac PCB software as well as Spectra auto-router. Very experienced in layout of impedance control and differential pairs using constraints Manager to length match on high speed buses with high pin count BGA. Layout from start to finish including assembly and fabrication drawings. Incorporation of strict PCB layout guide lines for S.I, Test and DFM. Used to use of Futurenet schematic capture software including creation and verification of connection lists. Ability to analyze mechanical tolerances for conformance to design guidelines. Possess strong interpersonal, communication, problem solving, and project management skills.