Nishant Lakhera, PhD
technical director semiconductor package engineering at nxp semiconductors@ NXP Semiconductors
Johnson City, Tennessee, United States
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Nishant Lakhera, PhD is a highly experienced professional with over 20 years of work experience in the electronics industry. He specializes in delivering IC packaging solutions and has expertise in electronic packaging and packaging structures. Nishant has worked at NXP Semiconductors in the Netherlands as an Ic Packaging Engineering Manager and Principal Ic Packaging Engineer. He also has experience as an Independent Study Research Mentor and Graduate Teaching Assistant. Nishant's skills include materials science, design of experiments, MATLAB, polymers, and failure analysis. He is based in the United States.
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Emails and Phone Numbers

@nxp.com
@gmail.com
@nxp.com
+1 307399****
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About

Delivering IC packaging solutions to the electronics industry. Specialties: Electronic Packaging and Packaging Structures (QFP, QFN, BGA, flip-chip, wafer level packaging, SOIC etc.) Electronic Packaging Materials (lead frames, substrates, die attaches, molding compounds, gels, dielectrics, thermal interface materials, solders, underfill etc.) Package reliability, assembly process, handling projects at OSATs from concept to high volume manufacturing.

Work Experience

High Tech Campus 60, Eindhoven, Noord-Brabant, 5656 AG, NL

Semiconductor Manufacturing

21724
Phone
+31 402729999
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Nishant Lakhera, PhD's Professional Milestones

  • Engineering Intern (2004-05-01~2004-08-01): Developed and implemented design projects, contributing to a successful career in engineering.
  • M.s. Graduate Research Assistant (2007-08-01~2009-05-01): Conducted groundbreaking studies, contributing to the field of research and advancing knowledge.
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Education

University of Wyoming
University of Wyoming

Mechanical Engineering,

Material Sciences,

Polymers

2006-2009
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