Nur Hanani
product development engineer at tf amd microelectronics penang@ TF-AMD Penang
Balik Pulau, Penang, Malaysia
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Nur Hanani is a Process Engineer with 5.6 years of experience, based in Malaysia. He has expertise in various areas such as wafer backgrind, frontside taping, and mount. Nur is skilled in Die Prep processes such as incoming wafer inspection, laser groove, sawing, pick and place, and 2nd optical inspection. He is a fast learner and thrives in a team environment. Nur is a proactive and independent leader with a strong attitude and can work under pressure. He has worked at Fabtronic Sdn Bhd and TF-AMD Penang, gaining valuable experience in product development and product development.
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Emails and Phone Numbers

@tf-amd.com
@tf-amd.com.my
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About

I have 3 years of experience as Process Engineer for wafer backgrind (WBG), frontside taping and wafer mount. I am familiar with Die Prep process such as incoming wafer inspection (IWI), laser groove, sawing, pick and place (PnP) and 2nd optical. I also incharge with wafer level Auto Optical Inspection (AOI). I'm a fast learner and love to gain new knowledge and experiences. Capable to efficiently working in a team and can be a good leader with passion to excel the given task. I'm a proactive and independent person that posses good attitude and able to work under pressure.

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Work Experience

TF AMD MICROELECTRONICS (PENANG) SDN. BHD. Phase 3 Free Industrial Zone, 11900 Bayan Lepas, Penang, Malaysia., Bayan Lepas, Pulau Pinang, 11900, MY

Semiconductor Manufacturing

708
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Nur Hanani's Professional Milestones

  • Process Engineer (2018-02-01~): Optimized manufacturing processes, improving efficiency and reducing costs.
  • Product Development Engineer 1 (2018-02-01~): Successfully developed and launched groundbreaking products, driving company growth and exceeding market targets.
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Education

Universiti Teknologi MARA
Universiti Teknologi MARA

Polymer Science And Technology

2015-2020
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