Paul Harvey

CORE SKILLS AND EXPERIENCE •Built and managed small and large engineering teams with emphasis on building trust, coaching and mentoring to deliver group and individual goals. •Delivering major projects on time by identifying key actions and obtaining appropriate resources required to complete. •Clear communicator, both verbal and written, experienced at delivering presentations to Senior Management, factory wide and at customer sites. •Use of 6 Sigma techniques such as DMAIC, FMEA, SPC, Design of Experiments, 8D and Pareto to problem solve and to drive continuous improvement programs. •Worked with cross functional teams to drive down product costs, reduce cycle times and improve yields. •Developed and specified new technologies and products and transferred into manufacturing. •Transferred technologies and products to other internal and external factories. •Experienced at recruiting and developing staff at all levels and in a variety of functions. •New Product Introduction and Development of new Technologies and their ramp into volume manufacture. •Wide experience of semiconductor technologies such as CMOS, PowerMosfet, Bicmos and IGBT with extensive process integration experience and knowledge of most wafer fab processing techniques.