vice president of engineering at qualcomm@ Qualcomm
Hyderabad, Telangana, India
Sathyadev Uppala
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University of Washington
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FlashIntel GPTSathyadev Uppala is a highly experienced professional with 25.8 years of work experience in the telecommunications industry. He has expertise in LTE, wireless technologies, RFE, CDMA, and embedded systems. Sathyadev has held various leadership positions at Qualcomm, including Vice President of Engineering and Senior Director of Engineering. He has also worked at Flarion Technologies and Nokia Bell Labs, where he contributed to the development of innovative products such as wireless chips and mobile devices. Sathyadev is currently based in Hyderabad, India.
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About
Jan 14, 2006 ... Sathyadev Uppala. Vice President of Engineering at Qualcomm. Location: Greater New York City Area; Industry: Wireless ... Senior Director of Engineering ... Member of Technical Staff ... Vice President, Technology at Qualcomm Incorporated...
Work Experience
vice president of engineering at qualcomm
Telecommunications
Sathyadev Uppala's Professional Milestones
- vice president of engineering at qualcomm (2006-01-01~): Successfully implemented cutting-edge technologies to drive company profitability and market expansion.
- Senior Director Of Engineering (2000-01-01~2006-01-01): Transformed engineering processes resulting in increased efficiency and enhanced productivity.
Education
Electrical Engineering
1991-1993Skill
Lte
Wireless
Rf
Cdma
Telecommunications
Wireless Technologies
Embedded Systems
Wifi
3gpp
Embedded Software
Digital Signal Processors
Mobile Devices
4g
Radio Frequency
Ip
Cellular Communications
Tcp/ip
Umts
Semiconductors
Certification
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