Simon Chen

1. Extensive knowledge and experience in RF (PA, LNA/switch) product engineering, design, operation, packaging, qualification, ATE/bench test, RF test parameter/solution, wafer technology, application 2.Strong hands-on experience in interacting with marketing, sales, design engineering, program manager, test engineer, package engineer on all activities of new product introduction (NPI) 3.Practical knowledge and experience in statistical tools (Data power) to analyze test data and debug issues of production and development. 4.Debug any issues in development, production, test, qualification 5.Setup SPC control line and monitored SPC, production yield and top 10 defects. Specialties: Semiconductor IC packaging process and assembly, ATE, RF product engineering, RF Testing, labview, bench/EVB test, VNA, Spectrum analyzer, Failure Analysis, Reliability, Qualification. Standards: JEDEC, AEC, TS16949, six sigma methodology, SPC, DOE, NPI, project management, yield improvement, cost reduction, leadship.