Stephen Moxham
senior package design engineer at micron technology@ Micron Technology
Boise, Idaho, United States
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Stephen Moxham is a Senior Package Design Engineer at Micron Technology with 35.1 years of experience in semiconductors, engineering management, simulations, product engineering, debugging, engineering, asic, soc, fpga, semiconductor packaging, and statistical process control. He has worked at Micron Technology in Boise, Idaho, in various roles, including Quality Engineer, Supplier Quality And Materials Engineer, and Engineer. With a strong background in semiconductor manufacturing, Stephen has contributed to the success of Micron Technology in the industry.
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Emails and Phone Numbers

@micron.com
@msn.com
+1 208368****
+1 208368****
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About

Senior Package Design Engineer at Micron Technology

Work Experience

8000 S Federal Way, Boise, Idaho, 83706, US

Semiconductor Manufacturing

26392
Phone
+1 2083684000

Stephen Moxham's Professional Milestones

  • Quality Engineer (2008-07-01~2013-07-01): Implementing quality control measures to optimize product quality and exceed customer expectations.
  • senior package design engineer at micron technology (1996-01-01~2008-06-01): Implementing a comprehensive quality and materials procurement strategy to enhance product quality and meet customer demand.
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Education

New York University - Polytechnic School of Engineering
New York University - Polytechnic School of Engineering

Aerospace,

Aeronautical And Astronautical Engineering

1987-1988
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