WEI LIN

• 10+ years of industry experience in consumer electronics and semiconductors • Proven track record with Apple in design-process architecture innovations, and end-to-end delivery of Touch/Force/Optical products from proof-of-concept, proto/EVT builds, to large-scale mass production • Strong communication and leadership skills • Broad knowledge, bottom-up innovations, and strong industry record in various module process technologies, including lamination, bonding, die-cut, interconnect, thermal interface materials, composite engineering, plastic forming/molding, flex, encapsulation, assembly, Si/glass micro-nano-structure/channel fabrication, and laminated conductive polymer electrolytic capacitor, etc. • Role model standards for materials qualification, FMEA, DFM, process development & optimization, CTQ, FA/CA, etc. • Deep expertise in materials R&D, including polymer composite (electrically conductive adhesives and thermal interface materials), fibers, laminates, thin films, nano-materials syntheses, phase analyses, metallurgy, and corrosion • In-depth understanding and hands-on experience in thin film deposition process and equipment, including ALD, thermal CVD, PECVD, PVD, and spin-coating of metals and dielectrics • Extensive experience and deep fundamental understanding of FA and characterizations, covering microstructure, composition, stress/strain, diffusion, crystallization, adhesion, phase diagram, and thermomechanical.