Semiconductor Packaging Engineer@ Analog Devices
Wilmington, Massachusetts, United States
Lejun Wang
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Georgia Institute of Technology
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FlashIntel GPTLejun Wang is a highly experienced electronic packaging professional with 20 years of expertise in NPI, design for manufacturing, and lean sigma manufacturing. He has a strong background in technology development, process characterization/qualification, and statistical data analysis. Lejun has worked for renowned companies such as Allegro MicroSystems, Analog Devices, Qualcomm, and Medtronic, where he held senior positions in packaging engineering and semiconductor manufacturing. He has a deep understanding of electronic packaging processes and has successfully led packaging activities for cellular modem products. Lejun is currently based in the United States.
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About
- 20+ years of experience in electronic packaging industry in NPI, Design for Manufacturability and Reliability (DFX), technology development, process characterization/qualification, statistical data analysis, structured problem solving, FMEA, PFA, CPI, DOE, SPC, and lean sigma manufacturing for mobile products and high reliability electronic modules in medical devices and CPU products. - 3 years of experience leading packaging NPI activities for Analog Devices’ MEMS and RF SiP products. - 7 years of experience leading packaging NPI activities for Qualcomm’s industry-leading cellular modem products, and continuously driving these products to thinner/smaller packages, by closely managing top assembly houses in planning and execution of Package Characterization and Qualification activities. - Extensive knowledge in electronic packaging processes including wafer bumping, die prep, flip chip attach, plasma, wire bond, molding, ball attach, SMT, and packaging materials including molding compound, underfill, flux and solder paste, conductive/non-conductive die attach material, and dam & fill encapsulant.
...See MoreWork Experience
Semiconductor Packaging Engineer
Semiconductor Manufacturing
Lejun Wang's Professional Milestones
- Principal Process Engineer (2003-10-01~2011-02-01): Developed and implemented efficient process improvements for improved efficiency and reduced downtime.
- Senior Staff Engineer (2012-05-01~2019-08-01): Developing innovative solutions to improve efficiency and productivity within the engineering field.
Education
Materials Science & Engineering,
Polymer Engineering
1994-1996Skill
Electronics Packaging
Design For Six Sigma Black Belt
Lean Sigma Green Belt
Doe
Spc
Fmea
Csp
Characterization
Design Of Experiments
Manufacturing
Electronics
Design For Manufacturing
R&d
Cross Functional Team Leadership
Process Simulation
Six Sigma
Minitab
Finite Element Analysis
Lean Manufacturing
Medical Devices
Failure Analysis
Scrum
Semiconductors
Certification
Colleagues
Ben Moore
Owner
Larry Duff
Owner Partner
Brian Sullivan
Owner
Matthew McClintock
Embedded Software Engineer | Business Owner
Allen Dwight Agustin
MBA In Data Science Student | Senior Equipment Engineer | Former Amat Endura Equipment Owner
Other Named Lejun Wang
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Lejun Wang works for Analog Devices
Lejun Wang's role in Analog Devices is Semiconductor Packaging Engineer
Lejun Wang works in the industry of Semiconductor Manufacturing
Lejun Wang's colleagues are Ben Moore,Larry Duff,Brian Sullivan
Lejun Wang's latest job experience is Semiconductor Packaging Engineer at Analog Devices
Lejun Wang's latest education in Georgia Institute of Technology
